The Batch Style High Vacuum Magnetron Sputtering Equipment can be used to deposit metal, semiconductor, and insulator films on different substrates such as glass, silicon wafer, metal, PET, etc. It is centrally controlled through HMI and programmatically implements machine operation, suitable for material research and development and small scale production in research institutes. The HNEC RD200 device can support up to 8-inch round substrates.

Product Features:

l High cleanliness, high vacuum environment

l Compatible with different power types (DC, medium frequency, RF, etc.)

l Achieves high-quality coating of materials with different conductive properties

l Fast pumping speed, with an extreme vacuum reaching 8E-5Pa

l Optional bias sputter deposition, strong film adhesion

l Good film uniformity, excellent repeatability

l Unique magnetic field design for higher target material utilization

l Compatible with different types of substrates, can realize coating on conventional silicon wafers, glass, and common flexible materials

Product Applications

l MEMS Sensors

l Photoelectric devices

l Photovoltaic solar energy

l Universities and research institutes, etc.

l Equipment installation and use environment